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  • 光缆10

FRP光缆加强芯专用乙烯基树脂

强英公司是专业从事SMC/BMC复合材料和FRP光缆加强件研发、生产、销售、技术服务于一体的制造企业。

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环氧乙烯基树脂指的是分子二端含有乙烯基脂基团,中间骨架为环氧树脂的一类不饱和取胜聚脂树脂,它们由不饱和有机一元羧酸和环氧树脂进行开环脂化反应得到。MFE-10乙烯基树脂为低苯乙烯含量环氧乙烯基酯树脂,对降低挥发性有机化合物的污染,改善工作环境都具有非常重要的意义。MFE-10特别适合于拉挤、缠绕等热固化玻璃钢成型工艺。 

FRP光缆加强芯是以玻璃纤维和环氧乙烯基酯树脂为主要原料,通过拉挤工艺而制成,可取代钢丝成为新型的光缆加强芯。 

通过多年的市场实践证明,使用本公司环氧乙烯基酯树脂生产的FRP光缆加强芯各项性能指标均达到规定的技术要求。 

An epoxy vinyl ester  resin, whose molecule contains an epoxy skeleton in the middle and terminating  with a vinyl group in both ends, is made by the ring-opening esterification  reaction between an organic unsaturated monobasic acid and an epoxy  resin.MFE-10 vinyl ester resin low styrene content, is all-important significance  of reducing volatile organic compound and improving labor environment.It is  ideal for pultrusion and filament winding.

FRP strength member is  made from MFE-10 vinyl ester resin and reinforced by fiberglass. It can be  instead of steel wire.

After years of market  practice, it has proved that FRP strength member produced by vinyl ester resin  of our company could meet the technical requirements in various performances.

MFE-10的物理力学性能(浇铸体)
Physical and mechanical properties of  MFE-10(casting matrix)

项目 Item

MFE-10

测试方法 Testing Method

拉伸强度/Mpa
Tensile strength

60

GB/T2568-1995

拉伸模量/Mpa
Tensile modulus

3.0

GB/T2568-1995

断裂伸长率/%
Elongation at break

2~3

GB/T2568-1995

弯曲强度/Mpa
Flexural strength

100

GB/T2570-1995

弯曲模量/Gpa
Flexural modulus

3.2

GB/T2570-1995

热变形温度/℃  (1.8Mpa)
Thermal deformation temperature

130

GB/T1634-1989

 

MFE-10的质量指标
 Quality specification of MFE-10

项目 Item

MFE-10

测试方法 Testing method

外观
Appearance

黄色透明 Yellow transparence

目测 Visual test

粘度/Pa•s(25℃)
Viscosity

0.40±0.05

GB/T7193.1-1987

酸值/mgKOH/g
Acid value

12.0±4.0

GB/T2895-1987

凝胶时间min(25℃)
Gelation    time

15.0±5.0

GB/T7193.6-1987

固体含量/%
Solid content

74.0±3.0

GB/T7193.3-1987

热稳定性/h(80℃)
Thermostability

24

GB/7193.5-1987